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Chinese tech company you never heard of may have forced Samsung’s hands to sign patent deal for next generation flash

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  • Samsung has signed an agreement with China’s YMTC to use its hybrid bonding tech
  • The move will prevent infringement claims in production of 400-layer NAND
  • US-China trade tensions may also have influenced the agreement

Samsung Electronics has signed a contract with Yangtze Memory Technologies Co. (YMTC) which will allow it to use the Chinese semiconductor company’s bonding technology in the production of its 400-layer NAND flash memory.

Founded in 2016 and headquartered in Wuhan, China, YMTC is a subsidiary of Tsinghua Unigroup, which is backed by the Chinese government. It focuses on 3D NAND flash memory, a critical component in storage devices like SSDs, smartphones, and data centers, and most famously developed Xtacking technology, a proprietary architecture that improves NAND flash performance and density.

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