Tech

SoftBank and Intel aim to prototype new HBM chip by 2026 with hopes of commercial launch by 2030

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  • SoftBank and Intel plan low-power memory to rival South Korean HBM
  • Saimemory aims for 2030 launch but faces major market delays
  • Intel and SoftBank are already stretched across AI chips and tech investments

SoftBank and Intel are reportedly teaming up to develop a new type of AI-focused high-bandwidth memory that they hope will rival HBM products produced by South Korean tech giants Samsung and SK Hynix.

A report from Nikkei Asia, claims the pair are aiming to create stacked DRAM chips with a new wiring structure that cuts power consumption by half, compared to current HBM chips.

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